For additional information on our process and products please refer to the titles shown below. All papers are in PDF format.
Ion Implant Characterization:
- "Real-Time High Res Dynamic Surface Charge Wafer Mapping for Advanced Ion Implant Process Control" - Poster presented at NIST Conference 03-07
- "Non-contact SPV-based Method for Advanced Ion Implant Process Control" - ASMC07
- "Surface Charge Profiling - An Advancement in Ion Implant Monitoring" - IIT Conference 2006
- "Photoelectric Measurement Method For Implanted Silicon: A Phenomenological Approach" - IIT Conference 2006
- "Comparison Of Production Metrology For High Angle Implantation" - IIT Conference 2004
- "Ion Implant Process Monitoring With A Dynamic Surface Photo-Charge Technique" - ASMC Conference 2004.
SOI Technology:
- "Implant Metrology for Bonded SOI Wafers Using a Surface Photo-voltage Technique" - Poster presented at ECS Meeting, May 2007
- "Non-Contact Method for thin SOI Characterization" - Poster presented at ECS Meeting, May 2007
Epi Characterization:
- "NIST traceable Small Signal Surface Photo Voltage Reference Wafer" - Poster presented at NIST Conference, 03-07
- "Use Of Non-Contact Resistivity Measurements For Epitaxy - SCP Method"
- "EpiLayer Quality & Yield Improvement Using The Surface Charge Profiler As A Non Destructive Diagnostic Technique" - Proceedings of the Electrochemical Society, Vol 99-16.
- "Use Of The Surface Charge Profiler For In-Line Monitoring Of Doping Concentration In Silicon Epitaxial Wafer Manufacturing" - SPIE Proceedings, Vol. 3884 Sept 1999.
Strained Silicon (SiGe and SiC):
Wafer Cleaning:
- "Cleaning Of Si surfaces By Lamp Illumination" - Presented at UCPSS, September, 2002
- "A Novel Pretreatment For Thin Film Measurements" - Published in Solid State Technology, September 1999
Metal Contamination: